pb rohs es52c5f10v-23.104m es52c5 f 10 v -23.104m series rohs compliant (pb-free) 3.0v 3.2mm x 5mm ceramic smd clipped sinewave tc(vc)xo operating temperature range -30c to +85c frequency stability 1.0ppm maximum nominal frequency 23.104mhz control voltage 1.5vdc 1.0vdc electrical specifications nominal frequency 23.104mhz frequency stability vs. frequency tolerance 1.0ppm maximum (at 25c 2c, at vdd=3.0vdc, and vc=1.5vdc) frequency stability 1.0ppm maximum (inclusive of operating temperature range, at vdd=3.0vdc and vc=1.5vdc) frequency stability vs. input voltage 0.3ppm maximum (5%) frequency stability vs. aging 1ppm/year maximum (at 25c) frequency stability vs. load 0.2ppm maximum (1kohm//1pf) operating temperature range -30c to +85c supply voltage +3.0vdc 5% input current 2.0ma maximum output voltage 0.7vp-p clipped sinewave minimum (external dc-cut capacitor required, 1000pf recommended) load drive capability 10kohms//10pf output logic type clipped sinewave control voltage 1.5vdc 1.0vdc frequency deviation 8ppm minimum transfer function positive transfer characteristic phase noise -80dbc/hz at 10hz offset, -115dbc/hz at 100hz offset, -135dbc/hz at 1khz offset, and -148dbc/hz at 10khz offset (typical values at 12.800mhz) start up time 5msec maximum storage temperature range -40c to +85c environmental & mechanical specifications esd susceptibility mil-std-883, method 3015, class 1, hbm: 1500v fine leak test mil-std-883, method 1014, condition a flammability ul94-v0 gross leak test mil-std-883, method 1014, condition c mechanical shock mil-std-883, method 2002, condition b moisture resistance mil-std-883, method 1004 moisture sensitivity j-std-020, msl 1 resistance to soldering heat mil-std-202, method 210, condition k resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010, condition b vibration mil-std-883, method 2007, condition a www.ecliptek.com | specification subject to change without notice | rev g 3/13/2011 | page 1 of 5
es52c5f10v-23.104m mechanical dimensions (all dimensions in millimeters) pin connection 1 voltage control 2 ground 3 output 4 supply voltage line marking 1 e23.104 e=ecliptek designator 2 xxyzz xx=ecliptek manufacturing code y=last digit of the year zz=week of the year 2.4 1.2 1.1 (x4) 1.4 (x4) www.ecliptek.com | specification subject to change without notice | rev g 3/13/2011 | page 2 of 5 5.00 0.20 3.20 0.20 1.20 0.20 (x4) 1.2 max 4 1 3 2 0.80 0.20 1.60 0.20 2.60 0.20 marking orient a tion all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters output w a veform 0v dc clock output v p-p
es52c5f10v-23.104m www.ecliptek.com | specification subject to change without notice | rev g 3/13/2011 | page 3 of 5 p o w er supply oscilloscope probe (note 2) v oltage meter f requency counter 0.01 f (note 1) 0.1 f (note 1) supply v oltage (v dd ) output v oltage control ground r l = 10kohms t est cir cuit f or v olta g e contr ol option current meter p o w er supply v oltage meter 1000pf c l = 10pf (note 3) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance .
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods es52c5f10v-23.104m high temperature infrared/convection ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev g 3/13/2011 | page 4 of 5
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods es52c5f10v-23.104m low temperature infrared/convection 240c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 240c maximum target peak temperature (tp target) 240c maximum 1 time / 230c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times / 80 seconds maximum 1 time ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev g 3/13/2011 | page 5 of 5
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